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HTC introduces HTC Grout+

Pores and cracks filling system

12-17-2019
HTC Grout+

HTC introduces a new system for the European market (EMAL) which simplifies pores and cracks filling during the HTC Superfloor™ process.

HTC Grout+ is a complement to the HTC Grouting and optimized for small-scale projects where time is of the essence, and/or specific areas with larger pin-holes to fix. Thanks to the dry processing method we avoid slurry and the need of splash protection and also sequential cleaning of the grinders and tools afterwards.

  • Larger void filling capabilities and a shorter drying time (1–2 hours) compared to HTC Gouting.
  • Adhesion is optimized to meet daily wear and tear.
  • Forms a strong fixing which is flexible enough to withstand vibrations from sequential grinding and everyday use afterwards.
  • Applied together with grinding dust to better match the color tone of the original floor.
  • Suitable for green buildings certification (DGnB, LEED, BNB, etc.)
  • Classified as not hazardous according to regulation (EC) No. 1272/2008 [CLP].

See application method in the product sheet below!

  • Mikael Stuhrmann
    Product Manager Floor Solutions & Academies
    HTC Sweden AB

    Mikael Stuhrmann
    +46 70 985 21 63 mikael.stuhrmann@husqvarnagroup.com

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